Invention Grant
- Patent Title: Midplane interconnect system with conductor twist mitigation
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Application No.: US15583159Application Date: 2017-05-01
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Publication No.: US09954295B2Publication Date: 2018-04-24
- Inventor: Wayne Genetti , Vladimir Tamarkin
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G02B6/28
- IPC: G02B6/28 ; H01R12/71 ; G02B6/44 ; G06F1/18 ; G06F13/40

Abstract:
A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.
Public/Granted literature
- US20170237189A1 MIDPLANE INTERCONNECT SYSTEM WITH CONDUCTOR TWIST MITIGATION Public/Granted day:2017-08-17
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