Invention Grant
- Patent Title: Copper foil composite, formed product and method of producing the same
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Application No.: US14369909Application Date: 2012-01-13
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Publication No.: US09955574B2Publication Date: 2018-04-24
- Inventor: Koichiro Tanaka , Kazuki Kammuri
- Applicant: Koichiro Tanaka , Kazuki Kammuri
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- International Application: PCT/JP2012/050591 WO 20120113
- International Announcement: WO2013/105266 WO 20130718
- Main IPC: B32B15/00
- IPC: B32B15/00 ; H05K1/03 ; B32B15/08 ; H05K1/09 ; H05K3/02 ; B32B7/02 ; B32B15/20 ; H05K1/05
Abstract:
A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1
Public/Granted literature
- US20150064493A1 COPPER FOIL COMPOSITE, FORMED PRODUCT AND METHOD OF PRODUCING THE SAME Public/Granted day:2015-03-05
Information query
