- Patent Title: Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
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Application No.: US14907478Application Date: 2014-07-23
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Publication No.: US09955583B2Publication Date: 2018-04-24
- Inventor: Masafumi Ishii , Misato Honda , Nobuaki Miyamoto
- Applicant: JX NIPPON MINING & METALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2013-153010 20130723; JP2013-153014 20130723; JP2013-160827 20130801; JP2013-160828 20130801
- International Application: PCT/JP2014/069489 WO 20140723
- International Announcement: WO2015/012327 WO 20150129
- Main IPC: B21C37/00
- IPC: B21C37/00 ; H05K3/02 ; B32B15/08 ; B32B15/20 ; B32B3/26 ; C25D7/06 ; H05K3/20 ; H05K3/38 ; C23C18/16 ; H05K1/09 ; H05K3/42 ; C25D1/04 ; C25D3/38 ; C25D3/56 ; C25D3/58 ; C25D5/02 ; C25D5/10 ; C25D5/18 ; C25D5/34 ; C25D5/48 ; C23C18/40
Abstract:
The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.
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