Invention Grant
- Patent Title: Heat dissipation assembly
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Application No.: US15250222Application Date: 2016-08-29
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Publication No.: US09955610B2Publication Date: 2018-04-24
- Inventor: Chih-Chi Wu , I-Shen Lin
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: CN201620776101U 20160722
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/40 ; H01L23/367

Abstract:
A heat dissipation assembly includes a heat sink, an electronic component and an elastic fastener. The heat sink includes a contact surface, an engaging part and a wing part. The engaging part and the wing part are protruded externally from the contact surface. An accommodation space is defined by the engaging part, the wing part and the contact surface. The engaging part has a concave structure disposed within the accommodation space. The electronic component is disposed on the contact surface. The elastic fastener includes a first free end, a bent segment and a second free end. The first free end is locked on an inner wall of the concave structure. The bent segment is contacted with a first sidewall of the wing part. The second free end is locked on an external surface of the electronic component. Consequently, the electronic component is attached and fixed on the contact surface.
Public/Granted literature
- US20180027699A1 HEAT DISSIPATION ASSEMBLY Public/Granted day:2018-01-25
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