Invention Grant
- Patent Title: Light emitting device, light emitting element mounting method, and light emitting element mounter
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Application No.: US14191203Application Date: 2014-02-26
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Publication No.: US09955619B2Publication Date: 2018-04-24
- Inventor: Takahiro Oyu , Tadaaki Miyata
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2013-037982 20130227
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/60 ; H05K13/04 ; H01L33/62 ; H01L23/00 ; H01L33/46 ; H05K3/32
Abstract:
Disclosed is a light emitting device including: a light emitting element including an LED chip and a phosphor layer provided at the light emitting side of the LED chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic conductive material.
Public/Granted literature
- US20140239331A1 LIGHT EMITTING DEVICE, LIGHT EMITTING ELEMENT MOUNTING METHOD, AND LIGHT EMITTING ELEMENT MOUNTER Public/Granted day:2014-08-28
Information query
IPC分类:
