Invention Grant
- Patent Title: Housing for encasing an electronic device
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Application No.: US15374960Application Date: 2016-12-09
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Publication No.: US09955762B2Publication Date: 2018-05-01
- Inventor: Gary A. Rayner
- Applicant: TreeFrog Developments, Inc.
- Applicant Address: US CO Fort Collins
- Assignee: TreeFrog Developments, Inc.
- Current Assignee: TreeFrog Developments, Inc.
- Current Assignee Address: US CO Fort Collins
- Main IPC: A45C11/00
- IPC: A45C11/00 ; A45C13/00 ; H04B1/3888

Abstract:
An apparatus for housing an electronic device includes a top member, a bottom member, and a compressible gasket seated in a channel in either the top member or the bottom member. The top member includes a perimeter portion defined by a proximal end portion, a distal end portion, and opposing side portions. The top member further including a first clasping mechanism. The bottom member includes an inner surface, a back surface, and a perimeter portion surrounding the inner surface and the back surface. The perimeter includes a wall including a second clasping mechanism.
Public/Granted literature
- US20170086551A1 Housing For Encasing An Electronic Device Public/Granted day:2017-03-30
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