A system and method for repairing a metal substrate includes an electrospark device and an electrode removably supported in the electrode holder. The electrospark device applies a coating of a material when placed into contact with the metal substrate. A cooling device to lowers the temperature of shielding gas flow below an ambient temperature. A conduit is arranged to direct a flow of the shielding gas to the interface of the electrode and the substrate to cool the area of the substrate receiving the coating.