Invention Grant
- Patent Title: Electronic device, liquid ejecting head, and manufacturing method of electronic device
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Application No.: US15245002Application Date: 2016-08-23
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Publication No.: US09956780B2Publication Date: 2018-05-01
- Inventor: Toshinari Nanba , Tomoyoshi Saito , Shuichi Tanaka
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2015-165507 20150825
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16
Abstract:
An electronic device includes a first substrate including a structure body protruded from one surface; and a second substrate stacked and disposed facing the one surface through a spacer, in which the first substrate and the spacer are bonded to each other by an adhesive, and in which the adhesive is extended up to the structure body along the one surface.
Public/Granted literature
- US20170057222A1 ELECTRONIC DEVICE, LIQUID EJECTING HEAD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE Public/Granted day:2017-03-02
Information query
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