Invention Grant
- Patent Title: Component supply device
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Application No.: US14911377Application Date: 2013-08-26
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Publication No.: US09957126B2Publication Date: 2018-05-01
- Inventor: Hiroyasu Ohashi , Hiroki Murase
- Applicant: FUJI MACHINE MFG. CO., LTD.
- Applicant Address: JP Chiryu
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/072773 WO 20130826
- International Announcement: WO2015/029121 WO 20150305
- Main IPC: B65H19/18
- IPC: B65H19/18 ; B65H20/20 ; H05K13/00 ; H05K13/04 ; H05K13/02
Abstract:
A component supply device provided with a rail which transports a carrier tape, and a movable member which is provided above the rail and moves up and down, in which a gap above the carrier tape which passes a bottom portion of the movable member is blocked by the movable member.
Public/Granted literature
- US20160192547A1 COMPONENT SUPPLY DEVICE Public/Granted day:2016-06-30
Information query
