Invention Grant
- Patent Title: System and method for an ovenized silicon platform using Si/SiO2 hybrid supports
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Application No.: US15470670Application Date: 2017-03-27
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Publication No.: US09957159B2Publication Date: 2018-05-01
- Inventor: Weibin Zhu , Navid Yazdi
- Applicant: Evigia Systems, Inc.
- Agency: James M. Smedley LLC
- Agent James Michael Smedley, Esq.
- Main IPC: H01L31/058
- IPC: H01L31/058 ; H01L21/76 ; H01L21/302 ; H01L21/461 ; B81C1/00 ; H01L27/12 ; B81B7/00
Abstract:
The present invention generally relates to an ovenized platform and a fabrication process thereof. Specifically, the invention relates to an ovenized hybrid Si/SiO2 platform compatible with typical CMOS and MEMS fabrication processes and methods of its manufacture. Embodiments of the invention may include support arms, CMOS circuitry, temperature sensors, IMUs, and/or heaters among other elements.
Public/Granted literature
- US20170275157A1 SYSTEM AND METHOD FOR AN OVENIZED SILICON PLATFORM USING Si/SiO2 HYBRID SUPPORTS Public/Granted day:2017-09-28
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