Invention Grant
- Patent Title: Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same
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Application No.: US15111337Application Date: 2014-05-09
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Publication No.: US09957348B2Publication Date: 2018-05-01
- Inventor: Dong Hwan Lee , Min Gyum Kim , Jung Seob Kim , Jin Min Cheon , Hwan Sung Cheon , Seung Han
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si, Gyeonggi-do
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2014-004794 20140114
- International Application: PCT/KR2014/004190 WO 20140509
- International Announcement: WO2015/108245 WO 20150723
- Main IPC: C08G59/40
- IPC: C08G59/40 ; C08L63/00 ; C08G59/68 ; C08G59/24 ; C08G59/62 ; C07D213/30 ; C07D213/84 ; H01L23/29 ; H01L23/31 ; B01J31/02 ; C07D213/04 ; C07D213/85
Abstract:
The present invention relates to a pyridinium-based compound of chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured by using the same.
Public/Granted literature
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