Invention Grant
- Patent Title: Resin composition, prepreg, and film
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Application No.: US14652553Application Date: 2013-12-13
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Publication No.: US09957349B2Publication Date: 2018-05-01
- Inventor: Toyoji Oshima , Shu Yoshida , Takeru Horino , Rintaro Takahashi
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2012-287276 20121228
- International Application: PCT/JP2013/083523 WO 20131213
- International Announcement: WO2014/103759 WO 20140703
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B32B27/26 ; B32B27/04 ; C08G59/20 ; C08G59/42 ; C08L63/00 ; C09D163/00 ; C08J5/18 ; H01L51/00 ; C08J5/24
Abstract:
A resin composition for transparent substrates comprises an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) comprises a cyclohexane tricarboxylic anhydride.
Public/Granted literature
- US20150337075A1 RESIN COMPOSITION, PREPREG, AND FILM Public/Granted day:2015-11-26
Information query
