Invention Grant
- Patent Title: Phenolic resin foam board, and method for manufacturing same
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Application No.: US14770023Application Date: 2014-02-26
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Publication No.: US09957368B2Publication Date: 2018-05-01
- Inventor: Takayuki Kuroda , Hisashi Mihori , Takatoshi Kitagawa
- Applicant: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATION
- Current Assignee: ASAHI KASEI CONSTRUCTION MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-036347 20130226
- International Application: PCT/JP2014/054725 WO 20140226
- International Announcement: WO2014/133023 WO 20140904
- Main IPC: C08J9/14
- IPC: C08J9/14 ; C08J9/36 ; B29C44/30 ; B29C44/46 ; B29C44/56 ; B05B1/20 ; B05B7/32

Abstract:
The present invention is a phenolic resin foam board having a thickness of 40 mm or more to 300 mm or less, when the phenolic resin foam board is sliced into n pieces (n≥5) at approximately equal intervals of 8 mm or more to 10 mm or less, a density of an n-th specimen is dn, an average density of n pieces of specimens is dave, a lowest density among the densities of n pieces of specimens is dmin, 0≤(dave−dmin)/dave≤0.12 is established, and when values for Di=(di+d(i+1))/2 are calculated, Di values are plotted and points corresponding to the Di values are connected, resulting in a density distribution curve, no straight line parallel to the horizontal axis intersects the density distribution curve at four points.
Public/Granted literature
- US20160002428A1 PHENOLIC RESIN FOAM BOARD, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-01-07
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