Invention Grant
- Patent Title: Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material
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Application No.: US14395430Application Date: 2013-03-19
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Publication No.: US09957589B2Publication Date: 2018-05-01
- Inventor: Keiichiro Oishi , Takashi Hokazono , Michio Takasaki , Yosuke Nakasato
- Applicant: Mitsubishi Shindoh Co., Ltd. , MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Mitsubishi Shindoh Co., Ltd.,MITSUBISHI MATERIALS CORPORATION
- Current Assignee: Mitsubishi Shindoh Co., Ltd.,MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Griffin and Szipl PC
- Priority: WOPCT/JP2013/051602 20130125
- International Application: PCT/JP2013/057808 WO 20130319
- International Announcement: WO2014/115342 WO 20140731
- Main IPC: C22C9/04
- IPC: C22C9/04 ; C22F1/08 ; H01B1/02
Abstract:
The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.
Public/Granted literature
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