Invention Grant
- Patent Title: Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device
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Application No.: US14787751Application Date: 2015-03-18
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Publication No.: US09957604B2Publication Date: 2018-05-01
- Inventor: Miki Miyanaga , Kenichi Watatani , Koichi Sogabe
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2014-061493 20140325; JP2015-016695 20150130
- International Application: PCT/JP2015/058061 WO 20150318
- International Announcement: WO2015/146745 WO 20151001
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C14/08 ; H01L21/02 ; C04B35/01 ; C04B35/626 ; H01L29/786 ; B28B3/00 ; C04B35/64 ; C23C14/35 ; H01L29/22

Abstract:
There is provided an oxide sintered body including indium, tungsten and zinc, wherein the oxide sintered body includes a bixbite type crystal phase as a main component and has an apparent density of higher than 6.5 g/cm3 and equal to or lower than 7.1 g/cm3, a content rate of tungsten to a total of indium, tungsten and zinc is higher than 1.2 atomic % and lower than 30 atomic %, and a content rate of zinc to the total of indium, tungsten and zinc is higher than 1.2 atomic % and lower than 30 atomic %. There are also provided a sputtering target including this oxide sintered body, and a semiconductor device including an oxide semiconductor film formed by a sputtering method by using the sputtering target.
Public/Granted literature
- US20170022602A1 OXIDE SINTERED BODY AND METHOD FOR MANUFACTURING THE SAME, SPUTTERING TARGET, AND SEMICONDUCTOR DEVICE Public/Granted day:2017-01-26
Information query
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