Invention Grant
- Patent Title: Pattern transfer mold and pattern formation method
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Application No.: US14334986Application Date: 2014-07-18
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Publication No.: US09957630B2Publication Date: 2018-05-01
- Inventor: Yongfang Li , Ryoichi Inanami , Akiko Mimotogi , Takashi Sato , Masato Saito , Koichi Kokubun
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2013-150947 20130719
- Main IPC: C25D5/02
- IPC: C25D5/02 ; C25D11/32 ; C25D11/02 ; C25D11/00 ; G03F7/00

Abstract:
According to one embodiment, a pattern transfer mold includes a base body, first and second stacked bodies, first and second electrodes. The base body includes a base unit including a first surface, a first protrusion provided on the first surface and having a first side surface, and a second protrusion provided on the first surface, separated from the first protrusion, and having a second side surface opposing the first side surface. The first stacked body is provided on the first side surface, and includes first conductive layers and a first insulating layer. The second stacked body is provided on the second side surface, separated from the first stacked body, and includes second conductive layers and a second insulating layer. The first electrode is electrically connected to at least one of the first conductive layers. The second electrode is electrically connected to at least one of the second conductive layers.
Public/Granted literature
- US20150021191A1 PATTERN TRANSFER MOLD AND PATTERN FORMATION METHOD Public/Granted day:2015-01-22
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