Systems and methods are described herein for creating a high isolation integrated current sensor whereby a portion of a current to be sensed by a magnetic field sensing circuit is split within the current sensor. The current sensor includes a primary conductor configured to carry a first portion of a primary current and a semiconductor substrate having a first surface and a second opposing surface. The first surface supports a magnetic field sensing circuit. The current sensor includes a first insulation layer disposed over the first surface, a conductive layer disposed over the first insulation layer and at least two interconnects coupled between the primary conductor and the conductive layer. A second portion of the primary current can flow through the conductive layer and the magnetic field sensing circuit is configured to sense the second portion of primary current.