A thermosiphon cooling system is presented. One embodiment of the thermosiphon cooling system includes a reservoir having a first portion configured to store a liquid coolant. The thermosiphon cooling system also includes a tubing unit coupled to the reservoir and disposed adjacent to at least one superconducting unit to be cooled and configured to receive the liquid coolant from the first portion of the reservoir, and circulate the received liquid coolant within the tubing unit to dissipate heat generated by the at least one superconducting unit. The received liquid coolant is circulated within the tubing unit by varying a density of the received liquid coolant at different portions of the tubing unit.