Invention Grant
- Patent Title: Substrate and method of forming photoresist layer
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Application No.: US14779827Application Date: 2015-08-12
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Publication No.: US09958724B2Publication Date: 2018-05-01
- Inventor: Guohe Liu
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agency: Ladas & Parry LLP
- Priority: CN201510485932 20150810
- International Application: PCT/CN2015/086733 WO 20150812
- International Announcement: WO2017/024543 WO 20170216
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G02F1/1335 ; G02F1/1343

Abstract:
A method of forming a photoresist layer includes: forming alignment electrodes on a base; mixing color QRs and photoresist to form a mixed material; coating the mixed material on the base; applying the base coated with the mixed material with positive and negative voltages so that the long axes of the color QRs align horizontally under the effect of the horizontal electric fields generated by the alignment electrodes; vacuum-drying the base coated with the mixed material to enhance the viscosity of the photoresist; interrupting electricity at a designated point to form a photoresist layer, wherein the long axes of QRs remain aligned horizontally; the color film substrate includes color resist films; when a backlight source emits blue light to the color film substrate, a color filter is disposed on top of the red color film to filtrate the blue light.
Public/Granted literature
- US20170139268A1 SUBSTRATE AND METHOD OF FORMING PHOTORESIST LAYER Public/Granted day:2017-05-18
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