Invention Grant
- Patent Title: Cooler and semiconductor module using same
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Application No.: US15027419Application Date: 2015-03-18
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Publication No.: US09960100B2Publication Date: 2018-05-01
- Inventor: Nobuhide Arai , Hiromichi Gohara
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD
- Current Assignee: FUJI ELECTRIC CO., LTD
- Current Assignee Address: JP Kanagawa
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2014-057802 20140320
- International Application: PCT/JP2015/058023 WO 20150318
- International Announcement: WO2015/141714 WO 20150924
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/36 ; H01L23/46 ; H01L23/467 ; H01L23/473 ; H01L23/433 ; H01L25/07 ; H01L25/18 ; H01L23/427 ; H01L23/367

Abstract:
A cooler includes: a jacket having an internal coolant conduction space surrounded by a main cooling surface top plate, an opposite bottom plate, and a side wall; coolant inflow and outflow pipes connected to two through holes in the side wall; a coolant introduction channel forming a part of the coolant conduction space and communicating with the coolant inflow pipe; a coolant discharge channel forming a part of the coolant conduction space and communicating with the coolant outflow pipe; and a fin unit between the coolant introduction and discharge channels. The fin unit includes a plurality of fins having separate main surfaces and thermally connected to the top plate. The fins have first ends acutely angled relative to a direction of flow of coolant in the coolant introduction channel, and second ends acutely angled relative to a direction of flow of coolant in the coolant discharge channel.
Public/Granted literature
- US20160379914A1 COOLER AND SEMICONDUCTOR MODULE USING SAME Public/Granted day:2016-12-29
Information query
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