Invention Grant
- Patent Title: Method for heating a metal member, method for bonding heated metal members, and apparatus for heating a metal member
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Application No.: US15292598Application Date: 2016-10-13
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Publication No.: US09960144B2Publication Date: 2018-05-01
- Inventor: Takaya Nagahama , Koichi Shiiba , Yoshinori Imoto
- Applicant: JTEKT Corporation
- Applicant Address: JP Osaka-shi
- Assignee: JTEKT CORPORATION
- Current Assignee: JTEKT CORPORATION
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-203686 20151015; JP2016-019936 20160204
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/00 ; H01L21/48 ; H01L21/67

Abstract:
A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the laser absorption. The second maximal thickness corresponds to a second maximal value of the laser absorption. The second minimal thickness corresponds to a second minimal value of the laser absorption, namely the minimal value of the laser absorption that appears between the second maximal value and a third maximal value, or the maximal value of the laser absorption that appears subsequent to the second maximal value.
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