Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15062512Application Date: 2016-03-07
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Publication No.: US09960174B2Publication Date: 2018-05-01
- Inventor: Takuo Ohashi , Masaaki Higuchi
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L27/11568 ; H01L27/11521 ; H01L29/788 ; H01L29/792 ; H01L29/66 ; H01L29/423 ; H01L21/28

Abstract:
According to one embodiment, a semiconductor device includes a semiconductor layer; an electrode layer; a first insulating film; a charge storage film; and a second insulating film. The first insulating film is provided between the electrode layer and the semiconductor layer. The charge storage film is provided between the first insulating film and the electrode layer. The charge storage film includes a charge trapping layer and a floating electrode layer. The floating electrode layer includes doped silicon. The second insulating film is provided between the floating electrode layer and the electrode layer.
Public/Granted literature
- US20170069647A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-03-09
Information query
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