Invention Grant
- Patent Title: Method for manufacturing TFT backplane and structure of TFT backplane
-
Application No.: US14390025Application Date: 2014-08-15
-
Publication No.: US09960195B2Publication Date: 2018-05-01
- Inventor: Wenhui Li , Yifan Wang , Chihyu Su , Xiaowen Lv
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201410351330 20140722
- International Application: PCT/CN2014/084446 WO 20140815
- International Announcement: WO2016/011686 WO 20160128
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
The present invention provides method for manufacturing a TFT backplane and a structure of a TFT backplane. The method includes (1) forming a gate terminal (2) and a first metal electrode M1 on a substrate (1); (2) sequentially forming a gate insulation layer (3), a semiconductor layer, and an etch stop layer on the gate terminal (2), the first metal electrode M1, and the substrate (1) in a successive manner and applying a photolithographic operation to form an island-like semiconductor layer (4) and an island-like etch stop layer (5); (3) applying a photolithographic operation to patternize the island-like etch stop layer (5) and the gate insulation layer (3) to form a plurality of etch stop layer vias (51) and a gate insulation layer via (31); (4) forming source/drain terminals (6) and a second metal electrode M2; (5) forming a passivation protection layer (7); (6) forming a planarization layer (8); (7) forming a pixel electrode layer (9); (8) forming a pixel definition layer (10); and (9) forming a spacer pillar (11).
Public/Granted literature
- US20160027804A1 METHOD FOR MANUFACTURING TFT BACKPLANE AND STRUCTURE OF TFT BACKPLANE Public/Granted day:2016-01-28
Information query
IPC分类: