- Patent Title: Removal of electrostatic charges from interposer for die attachment
-
Application No.: US14024543Application Date: 2013-09-11
-
Publication No.: US09960227B2Publication Date: 2018-05-01
- Inventor: Michael J. Hart , James Karp
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent Kevin T. Cuenot; Robert M. Brush
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/544 ; H01L23/58 ; H01L23/52 ; H01L29/02 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L25/00 ; H01L25/065 ; H01L25/07 ; H01L25/11 ; H01L25/075 ; H01L21/48 ; H01L25/04 ; H01L21/66 ; H01L23/60 ; H01L23/498
Abstract:
A wafer includes a first interposer having a first patterned metal layer and a second interposer having a second patterned metal layer. The wafer includes a metal connection in a scribe region of the wafer that electrically couples the first patterned metal layer of the first interposer with the second patterned metal layer of the second interposer forming a global wafer network. The wafer further includes a probe pad located in the scribe region that is electrically coupled to the global wafer network.
Public/Granted literature
- US20150069577A1 REMOVAL OF ELECTROSTATIC CHARGES FROM INTERPOSER FOR DIE ATTACHMENT Public/Granted day:2015-03-12
Information query
IPC分类:
