Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15279840Application Date: 2016-09-29
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Publication No.: US09960235B2Publication Date: 2018-05-01
- Inventor: Yasuyuki Hoshi , Yuichi Harada , Akimasa Kinoshita , Yasuhiko Oonishi
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: JP2014-185709 20140911
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/06 ; H01L29/78 ; H01L29/12 ; H01L29/08 ; H01L29/10 ; H01L29/16

Abstract:
A semiconductor device including a semiconductor substrate of a first conductivity type, a plurality of base regions of a second conductivity type formed on a first principal surface of the semiconductor substrate via a semiconductor layer of the first conductivity type, and a plurality of source regions of the first conductivity type formed in the base regions. Each base region, in a top-down view from an angle perpendicular to the first principle surface, is of a polygonal shape. Each adjacent two of the base regions in the top-down view have two sides, one from each of the two base regions, that face each other across a portion of the semiconductor layer, the source region being formed at only one of the two sides.
Public/Granted literature
- US20170018609A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-01-19
Information query
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