Invention Grant
- Patent Title: Fin-based RF diodes
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Application No.: US15616653Application Date: 2017-06-07
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Publication No.: US09960248B2Publication Date: 2018-05-01
- Inventor: Jagar Singh
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L29/66 ; H01L29/861 ; H01L21/265 ; H01L29/06 ; H01L21/762 ; H01L27/08

Abstract:
Methods for forming a fin-based RF diode with improved performance characteristics and the resulting devices are disclosed. Embodiments include forming fins over a substrate, separated from each other, each fin having a lower portion and an upper portion; forming STI regions over the substrate, between the lower portions of adjacent fins; implanting the lower portion of each fin with a first-type dopant; implanting the upper portion of each fin, above the STI region, with the first-type dopant; forming a junction region around a depletion region and along exposed sidewalls and a top surface of the upper portion of each fin; and forming a contact on exposed sidewalls and a top surface of each junction region.
Public/Granted literature
- US20180026113A1 FIN-BASED RF DIODES Public/Granted day:2018-01-25
Information query
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