Invention Grant
- Patent Title: Method for manufacturing semiconductor device
-
Application No.: US15606030Application Date: 2017-05-26
-
Publication No.: US09960261B2Publication Date: 2018-05-01
- Inventor: Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2015-060420 20150324; JP2015-060421 20150324; JP2015-066943 20150327
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/425 ; H01L29/786 ; H01L27/1156 ; H01L27/108 ; H01L21/8258 ; H01L27/092

Abstract:
A transistor with stable electrical characteristics is provided. Provided is a method for manufacturing a semiconductor device that includes, over a substrate, an oxide semiconductor, a first conductor, a first insulator, a second insulator, and a third insulator. The oxide semiconductor is over the first insulator. The second insulator is over the oxide semiconductor. The third insulator is over the second insulator. The first conductor is over the third insulator. The oxide semiconductor has a first region and a second region. To form the first region, ion implantation into the oxide semiconductor is performed using the first conductor as a mask, and then hydrogen is added to the oxide semiconductor using the first conductor as a mask.
Public/Granted literature
- US20170365693A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2017-12-21
Information query
IPC分类: