Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US14647443Application Date: 2014-03-31
-
Publication No.: US09960267B2Publication Date: 2018-05-01
- Inventor: Nobuki Miyakoshi
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Hauptman Ham, LLP
- Priority: WOPCT/JP2013/059785 20130331
- International Application: PCT/JP2014/059578 WO 20140331
- International Announcement: WO2014/163058 WO 20141009
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/739 ; H01L29/40 ; H01L29/423 ; H01L29/66 ; H01L29/778 ; H01L21/335 ; H01L21/336 ; H01L29/10

Abstract:
In a semiconductor device provided with a MOSFET part and a gate pad part defined on a semiconductor substrate which is formed by laminating a low resistance semiconductor layer and a drift layer, the gate pad part includes: the low resistance semiconductor layer; the drift layer formed on the low resistance semiconductor layer; a poly-silicon layer constituting a conductor layer and a gate pad electrode formed above the drift layer over the whole area of the gate pad part with a field insulation layer interposed therebetween; and a gate oscillation suppressing structure where a p-type diffusion region electrically connected with the a source electrode layer and a p-type impurity non-diffusion region are alternately formed on a surface of the drift layer.
Public/Granted literature
- US20150325691A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-11-12
Information query
IPC分类: