Invention Grant
- Patent Title: Patch antenna
-
Application No.: US14808117Application Date: 2015-07-24
-
Publication No.: US09960493B2Publication Date: 2018-05-01
- Inventor: Kwai-Man Luk , Yujian Li
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowloon
- Assignee: CITY UNIVERSITY OF HONG KONG
- Current Assignee: CITY UNIVERSITY OF HONG KONG
- Current Assignee Address: HK Kowloon
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H01Q9/04
- IPC: H01Q9/04

Abstract:
A patch antenna is presented herein. The patch antenna can include a substrate layer, a dielectric layer and a conductive layer. The substrate layer can include a hollow thermoplastic structure. The dielectric layer can be attached to a surface of the substrate layer. Furthermore, the dielectric layer can include a thermoplastic structure filled with a fluid. The conductive layer can be associated with another surface of the substrate layer.
Public/Granted literature
- US20170025760A1 PATCH ANTENNA Public/Granted day:2017-01-26
Information query