Invention Grant
- Patent Title: Thermally efficient connector system
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Application No.: US15109862Application Date: 2015-03-26
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Publication No.: US09960553B2Publication Date: 2018-05-01
- Inventor: Kent E. Regnier
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agent Jeffrey K. Jacobs
- International Application: PCT/US2015/022705 WO 20150326
- International Announcement: WO2015/148786 WO 20151001
- Main IPC: H01R13/00
- IPC: H01R13/00 ; H01R25/00 ; H01R12/72 ; H01R13/6587 ; H01R13/6594 ; H05K7/20 ; H01R12/70 ; H01R13/717

Abstract:
A connector assembly can be provided. A receptacle includes terminals that can be positioned in a card slot on a 0.60 mm pitch (or greater). A biasing element can be provided in the card slot to engage a mating paddle card. The receptacle can be configured to allow air to flow from a front face to a rear face, the air passing through a middle wall. A plug assembly can be provided that includes a conductive body and is configured to generate some amount of heat. The body can include a surface that has cooling grooves. The cooling grooves allow air flow over the plug assembly so that the plug assembly can be cooled directly.
Public/Granted literature
- US20170005446A1 THERMALLY EFFICIENT CONNECTOR SYSTEM Public/Granted day:2017-01-05
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