Invention Grant
- Patent Title: Wiring harness and routing structure of the same
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Application No.: US13786811Application Date: 2013-03-06
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Publication No.: US09960577B2Publication Date: 2018-05-01
- Inventor: Hideomi Adachi , Hidehiko Kuboshima
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2010-232067 20101015
- Main IPC: H02G3/04
- IPC: H02G3/04 ; B60R16/02

Abstract:
To provide a wiring harness and a routing structure of the wiring harness able to prevent high temperature and its influence caused by heat generation. A wiring harness includes a harness main body having a plurality of high voltage conducting lines. The high voltage conducting lines are arranged with gaps between the adjacent high voltage conducting lines. Further, the plurality of high voltage conducting lines are arranged to maintain an interval as the gap. It becomes a routing structure of the wiring harness when curved portions of such high voltage conducting lines are directly or indirectly made contact with a shield cover covering the wiring harness. Because the high voltage conducting lines of the wiring harness are arranged with gaps between the adjacent high voltage conducting lines, radiation performance of the wiring harness is better than the wiring harness of which high voltage conducting lines are bundled.
Public/Granted literature
- US20130192890A1 WIRING HARNESS AND ROUTING STRUCTURE OF THE SAME Public/Granted day:2013-08-01
Information query
IPC分类: