Invention Grant
- Patent Title: Analog behavior modeling for 3-phase signaling
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Application No.: US14156329Application Date: 2014-01-15
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Publication No.: US09961174B2Publication Date: 2018-05-01
- Inventor: Xiang Li , Nakul Midha , Varun Radhakrishnan , Chulkyu Lee
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza LLP
- Main IPC: H04M17/00
- IPC: H04M17/00 ; H04M1/02 ; H04B17/00 ; H04L25/02 ; H04L25/49 ; G01R31/28

Abstract:
System, methods and apparatus are described that model analog behavior in a multi-wire, multi-phase communications link. A digital signal representative of a physical connection in a communications link and a virtual signal characterizing a three-phase signal transmitted over the physical connection are generated. The virtual signal may be configured to model one or more analog characteristics of the physical connection. The analog characteristics may include voltage states defining the three-phase signal. The analog characteristics of the physical connection include at least three voltage states corresponding to signaling states of the three-phase signal.
Public/Granted literature
- US20150201052A1 ANALOG BEHAVIOR MODELING FOR 3-PHASE SIGNALING Public/Granted day:2015-07-16
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