A method for monitoring an operation location of a surface processing apparatus is provided, wherein a surface processing apparatus is allocated to a spatially delimited operation area by way of an allocating unit, and wherein the position of the surface processing apparatus is established, and it is determined whether the surface processing apparatus is disposed inside or outside the operation area. For versatility, the surface processing apparatus is allocated to a first operation area and at least one second operation area that is spatially separated from the first operation area, and it is determinable whether the surface processing apparatus is disposed outside the first operation area but inside the at least one second operation area. Furthermore, the invention relates to a monitoring system for performing the method.