An integrated power electronics assembly module includes a power unit and a clamping auxiliary circuit board. The power unit includes a power level circuit board and a shielding casing. The power level circuit board is contained in the shielding casing. The clamping auxiliary circuit board is disposed against the shielding casing and stacked with the power level circuit board to reduce a parasitic inductance generated by a commutation loop constituted by the power level circuit board and the clamping auxiliary circuit board. The clamping auxiliary circuit board is electrically coupled to the power level circuit board via the shielding casing.