A trench (20) is introduced into a carrier (10) for electrical components (30) on a first surface (O10a) of the carrier into the material of the carrier (10). The carrier (10) is cut through by a cut (60) being introduced into the material of the carrier from a second surface (O10b) of the carrier (10), said second surface being situated opposite the first surface. The cut is implemented in such a way that the cut (60) runs through the trench (20) on the first surface (O10a) of the carrier. By providing a trench (20) in the material layers of the carrier (10) which are near the surface, it is possible to prevent material from breaking out of the carrier during the singulation of devices (1, 2).