Invention Grant
- Patent Title: Method for manufacturing resin multilayer board
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Application No.: US14926316Application Date: 2015-10-29
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Publication No.: US09961780B2Publication Date: 2018-05-01
- Inventor: Hirofumi Shinagawa , Shigeru Tago , Masaki Kawata , Yuki Ito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne and Gordon LLP
- Priority: JP2013-127447 20130618; JP2013-144146 20130710; JP2014-004357 20140114
- Main IPC: H05K3/32
- IPC: H05K3/32 ; H05K1/18 ; H05K3/46 ; H05K3/30 ; H05K3/00

Abstract:
A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred.
Public/Granted literature
- US20160050766A1 METHOD FOR MANUFACTURING RESIN MULTILAYER BOARD Public/Granted day:2016-02-18
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