A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.