Invention Grant
- Patent Title: Systems and methods for performing chemical mechanical planarization
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Application No.: US14148870Application Date: 2014-01-07
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Publication No.: US09962801B2Publication Date: 2018-05-08
- Inventor: Shen-Nan Lee , Teng-Chun Tsai , Yung-Cheng Lu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L21/306
- IPC: H01L21/306 ; B24B37/005 ; B24B37/04 ; B24B1/04 ; H01L21/321 ; H01L21/67 ; H01L21/02 ; H01L21/768 ; B24B37/11 ; B24B37/30
Abstract:
Systems and methods are provided for performing chemical-mechanical planarization. An example system includes: a polishing head, a polishing pad, a slurry distribution component, and a reactant distribution component. The polishing head is configured to perform chemical-mechanical planarization on an article. The polishing pad is configured to support the article. The slurry distribution component is configured to provide a slurry on the polishing pad. The reactant distribution component is configured to provide an oxidizer material on the polishing pad to generate a plurality of radicals to react with the article.
Public/Granted literature
- US20150194318A1 SYSTEMS AND METHODS FOR PERFORMING CHEMICAL MECHANICAL PLANARIZATION Public/Granted day:2015-07-09
Information query
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