Invention Grant
- Patent Title: Substrate conveyance apparatus
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Application No.: US14855561Application Date: 2015-09-16
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Publication No.: US09962840B2Publication Date: 2018-05-08
- Inventor: Shinji Wakabayashi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2014-191655 20140919
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B25J11/00 ; B25J15/00 ; B25J9/10 ; H01L21/67

Abstract:
Disclosed is a substrate conveyance apparatus that collectively conveys a plurality of substrates. The apparatus includes: a plurality of substrate placement racks disposed at intervals in a height direction and configured to simultaneously place the substrates thereon; a substrate placement rack holder configured to integrally hold the plurality of substrate placement racks; and a moving mechanism connected to the substrate placement rack holder and configured to integrally move the plurality of substrate placement racks. The moving mechanism includes: a first arm unit having a first support supported from an outside, and connected to one end of the substrate placement rack holder in a longitudinal direction; a second arm unit having a second support supported from the outside, and connected to another end of the substrate placement rack holder in the longitudinal direction; and a connecting portion which connects the first arm unit to the second arm unit.
Public/Granted literature
- US20160082599A1 SUBSTRATE CONVEYANCE APPARATUS Public/Granted day:2016-03-24
Information query
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