- Patent Title: Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission
-
Application No.: US15108804Application Date: 2015-01-27
-
Publication No.: US09963541B2Publication Date: 2018-05-08
- Inventor: Tomoyuki Hirayama , Naoya Sugimoto
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-023193 20140210
- International Application: PCT/JP2015/052106 WO 20150127
- International Announcement: WO2015/118989 WO 20150813
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/138 ; C08G59/32 ; C08G59/38 ; C09D163/00 ; C09D171/00 ; G02B6/10 ; C08L63/00 ; C08G59/40 ; C08G65/22 ; G02B6/122 ; C08G59/24 ; C08G59/68 ; C08G65/18

Abstract:
According to the present invention, a photosensitive resin composition for an optical waveguide contains a resin component and a photopolymerization initiator. The resin component has an absorbance of less than 0.03 as measured at 2960 cm−1 by an attenuated total reflection measurement (ATR) method by means of a Fourier transform infrared spectrophotometer (FT-IR), and includes a polymerizable substituent-containing resin as a main component. Where the inventive optical waveguide photosensitive resin composition is used as a material for the optical waveguide, particularly as a core layer formation material for the optical waveguide, it is possible to reduce a loss, for example, by avoiding vibrational absorption occurring at an optical waveguide transmission light wavelength of 850 nm due to a resin skeleton.
Public/Granted literature
Information query