Invention Grant
- Patent Title: Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same
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Application No.: US15300645Application Date: 2015-03-25
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Publication No.: US09963542B2Publication Date: 2018-05-08
- Inventor: Toshio Shiobara , Junichi Sawada , Miyuki Wakao , Tsutomu Kashiwagi , Naofusa Miyagawa , Yoshihiro Kawada , Chie Sasaki , Naosuke Taniguchi
- Applicant: Shin-Etsu Chemical Co., Ltd. , Nippon Kayaku Kabushiki Kaisha
- Applicant Address: JP JP
- Assignee: Shin-Etsu Chemical Co., Ltd.,Nippon Kayaku Kabushiki Kaisha
- Current Assignee: Shin-Etsu Chemical Co., Ltd.,Nippon Kayaku Kabushiki Kaisha
- Current Assignee Address: JP JP
- Agency: Wood, Phillips, Katz, Clark & Mortimer
- Priority: JP2014-071020 20140331
- International Application: PCT/JP2015/059119 WO 20150325
- International Announcement: WO2015/151957 WO 20151008
- Main IPC: C08G59/38
- IPC: C08G59/38 ; C08G59/32 ; C08G59/42

Abstract:
A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided.An epoxy resin represented by the following Formula (1): wherein R1 represents a hydrocarbon group having 1 to 6 carbon atoms; X represents an organic group having a norbornane epoxy structure, or a hydrocarbon group having 1 to 6 carbon atoms; n represents an integer from 1 to 3; plural R1s and plural Xs present in the formula may be respectively identical or different; and two or more of plural Xs represent an organic group having a norbornane epoxy structure.
Public/Granted literature
- US20170107322A1 SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING THE EPOXY RESIN, AND CURED PRODUCT OF SAME Public/Granted day:2017-04-20
Information query
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