Invention Grant
- Patent Title: Condensation-curable silicone resin composition, condensation-curable silicone resin cured product, and sealed optical semiconductor element
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Application No.: US14911621Application Date: 2014-05-26
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Publication No.: US09963552B2Publication Date: 2018-05-08
- Inventor: Noriaki Fukuda , Katsumasa Yamamoto
- Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Applicant Address: JP Hyogo
- Assignee: Sumitomo Seika Chemicals Co., Ltd.
- Current Assignee: Sumitomo Seika Chemicals Co., Ltd.
- Current Assignee Address: JP Hyogo
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2013-170559 20130820; JP2013-253170 20131206
- International Application: PCT/JP2014/063822 WO 20140526
- International Announcement: WO2015/025577 WO 20150226
- Main IPC: C08G77/16
- IPC: C08G77/16 ; C08G77/26 ; C08L83/04 ; C09J183/08 ; H01L33/56 ; C08G77/388

Abstract:
The present invention aims to provide a condensation-curable silicone resin composition with excellent adhesion properties. The present invention also aims to provide a condensation-curable silicone resin cured product formed from the condensation-curable silicone resin composition and a sealed optical semiconductor element formed by using the condensation-curable silicone resin composition. The present invention is a condensation-curable silicone resin composition including: a condensation-curable silicone resin mixture; and an adhesion-imparting agent, the adhesion-imparting agent including a compound that includes at least one group A, wherein the group A is represented by the formula wherein R2a represents a C1-C8 alkylene group in which a carbon atom other than a carbon atom bonded to a silicon atom is optionally partially substituted with an oxygen atom; R2b's each independently represent a C1-C3 alkylene group; R3's each independently represent a C1-C3 alkylene group; R4's each independently represent a hydrogen atom, a C1-C3 alkyl group, an OH group-containing C1-C3 alkyl group, or a halogen group; and x is an integer of 0 to 2.
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