An epoxy resin composition comprising the following constituents [A], [B], and [C]:[A] an epoxy resin having a structure represented by a formula (1); in which a ring Z represents a condensed polycyclic aromatic hydrocarbon ring, R1 and R2 represent a substituent, R3 represents a hydrogen atom or a methyl group, k is an integer of 0 to 4, m is an integer of 0 or more, and n is an integer of 1 or more; [B] at least one resin selected from the group consisting of the following [Bx], [By] and [Bz]; [Bx] a bisphenol type epoxy resin; [By] an amine type epoxy resin; and [Bz] a thermoplastic resin; [C] a polyamine curing agent. Provided is an epoxy resin composition which provides a cured product having excellent heat resistance, toughness and elastic modulus.