The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.