Invention Grant
- Patent Title: Quantum dot-resin nanocomposite and method of preparing same
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Application No.: US14308506Application Date: 2014-06-18
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Publication No.: US09963632B2Publication Date: 2018-05-08
- Inventor: Haeng Deog Koh , Hyun A Kang , Eun Joo Jang , Na Youn Won
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR10-2013-0114044 20130925
- Main IPC: C09K11/02
- IPC: C09K11/02 ; C09K11/08 ; H01L33/50 ; B82Y40/00 ; B82Y20/00
Abstract:
A quantum dot-resin nanocomposite including a nanoparticle including a curable resin and a plurality of quantum dots contacting the nanoparticle. Also, a method of preparing the nanocomposite, and a molded article including the nanocomposite.
Public/Granted literature
- US20150083970A1 QUANTUM DOT-RESIN NANOCOMPOSITE AND METHOD OF PREPARING SAME Public/Granted day:2015-03-26
Information query
