Invention Grant
- Patent Title: Measurement device for ring-shaped assembly, measurement method for ring-shaped assembly, and manufacturing method of rotating machine
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Application No.: US14902200Application Date: 2014-07-14
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Publication No.: US09964393B2Publication Date: 2018-05-08
- Inventor: Kunihiko Waki , Kenichi Arase , Yugo Tokunaga
- Applicant: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
- Applicant Address: JP Kanagawa
- Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
- Current Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-147520 20130716
- International Application: PCT/JP2014/068685 WO 20140714
- International Announcement: WO2015/008725 WO 20150122
- Main IPC: G01B5/14
- IPC: G01B5/14 ; G01B5/20 ; F01D11/00 ; F01D25/28 ; G01M15/14

Abstract:
A measurement device for a ring-shaped assembly that measures relative positions, is provided with: a first contact section that comes into contact with a reference surface that is continuous in the circumferential direction of the ring-shaped member and is capable of sliding in the circumferential direction; a second contact section capable of pressing against an opposing surface that faces an opposite side in the radial direction from the reference surface of the ring-shaped member; a base section that supports the first contact section and the second contact section; a third contact section that comes into contact with a measurement-target part of the assembled member; a connecting section that connects the third contact section and the base section; and a measurement unit that measures a displacement of the third contact section relative to the base section.
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