Invention Grant
- Patent Title: Pressure sensor device with anchors for die shrinkage and high sensitivity
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Application No.: US15153483Application Date: 2016-05-12
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Publication No.: US09964458B2Publication Date: 2018-05-08
- Inventor: Jen-Huang Albert Chiou , Shiuh-Hui Steven Chen
- Applicant: Continental Automotive Systems, Inc.
- Applicant Address: US MI Auburn Hills
- Assignee: Continental Automotive Systems, Inc.
- Current Assignee: Continental Automotive Systems, Inc.
- Current Assignee Address: US MI Auburn Hills
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L9/02 ; G01L9/08 ; G01L19/04
Abstract:
The voltage output span and sensitivity from a MEMS pressure sensor are increased and pressure nonlinearity is reduced by thinning a diaphragm and forming the diaphragm to include anchors that are not connected to or joined to diaphragm-stiffening beams or thickened regions of the diaphragm.
Public/Granted literature
- US20170328797A1 PRESSURE SENSOR DEVICE WITH ANCHORS FOR DIE SHRINKAGE AND HIGH SENSITIVITY Public/Granted day:2017-11-16
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