An electroplating solution analyzing apparatus measures a first current that flows between a counter electrode and a working electrode placed in electroplating solution while depositing metal on the working electrode by applying a set first voltage between a reference electrode and the working electrode and then measures a second current that flows between the counter electrode and the working electrode with a cycle set in advance while dissolving the metal deposited on the working electrode into the electroplating solution by applying a second voltage, which changes at a rate set in advance, between the reference electrode and the working electrode. During measurement, the first voltage is changed in a range set to produce a current density within a current density range set in advance. An analysis process then analyzes the state of the electroplating solution based on the values acquired by measurement.