Invention Grant
- Patent Title: Resist pattern forming method and developer for lithography
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Application No.: US15241519Application Date: 2016-08-19
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Publication No.: US09964851B2Publication Date: 2018-05-08
- Inventor: Kazufumi Sato , Mitsuo Hagihara , Tomoya Kumagai , Masahito Yahagi , Kenta Suzuki , Takayoshi Mori , Ryoji Watanabe
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2015-167116 20150826
- Main IPC: G03F7/32
- IPC: G03F7/32 ; G03F7/20

Abstract:
A method of forming a resist pattern including forming a resist film on a support using a resist composition; subjecting the resist film to exposure; and forming a resist pattern by developing the resist film having undergone the exposure, in which the developing is performed using a developer which contains a basic compound represented by the following formula (1) and tetrabutylammonium hydroxide, and in which the concentration of tetrabutylammonium hydroxide is equal to or greater than 2.5% by mass and less than 2.8% by mass: in which R1 to R4 each independently represent a linear or branched alkyl group, and the total number of carbon atoms contained in each of the alkyl groups represented by R1 to R4 is 4 to 15.
Public/Granted literature
- US20170059994A1 RESIST PATTERN FORMING METHOD AND DEVELOPER FOR LITHOGRAPHY Public/Granted day:2017-03-02
Information query
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