An electronic assembly including a circuit board, a heat-generating element, and a heat pipe is provided. The heat-generating element includes a bottom surface and a side surface connected to the bottom surface. The heat-generating element is mounted on the circuit board via the bottom surface. The heat pipe is thermally coupled to the side surface of the heat-generating element to absorb heat from the heat-generating element. Additionally, an electronic device includes a casing, a display, and the above-described electronic assembly. The display is mounted on the casing. The electronic assembly is disposed in the casing. The heat-generating element is mounted on the circuit board and its side surface is thermally coupled to the heat pipe. As a result, the limitation on the thickness of the heat pipe is relaxed, thereby allowing the efficiency of the heat pipe to be increased.